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Nestle, Pepsi Headline RadTech Packaging Conference Focused on UV+EB Applications

UV+EB Packaging Conference will be held Oct. 25, 2017 in Philadelphia.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Fast emerging processes including inkjet, UV LEDs and electron beam (EB) offer consumer goods companies a wider palette than ever to create impactful, safe, compliant packaging. Amaury Patin, with the Nestlé Research Center, and Todd Fayne of PepsiCo will share their experiences with the technology at the UV+EB Packaging Conference, on Oct. 25, 2017, in Philadelphia.
 
This one-day event features a full day of talks, including knowledge panels on migration and regulation, a table top exhibition, and a special session by the Foil and Special Effects Association (FSEA). In addition, RadTech, the non-profit trade association for UV+EB Technology, will hold a member meeting, open to all, the following day on Oct. 26. For more information and to register, visit:  http://www.radtech.org/uveb2017/

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